Products
Powered by our patented Z-axis Fiber technology
ZRT Thermal Interface Materials
Solving Efficiency Losses of Thermal Interfaces
- Solving the performance and reliability issues of semiconductors for computing, telecom, and power applications
- Z-axis Fiber Polymer TIM:
- 20 to 50 W/m-K conductivity
- Zipper-like effect eliminates delamination
- Z-axis Fiber Solder & Liquid Metal TIM:
- 150 W/m-K thermal conductivity
- Sponge-like effect eliminates pump out, especially with liquid metal
- Proven and highly scaled manufacturing process (1,000,000 m2/yr capacity)
- Does not contain nanomaterials, which are very expensive and hard-to-scale
Bipolar Plates
Fuel cell bipolar plates (BPPs) made with thermoformed ZRT films
- 60% lighter than stainless steel BPPs, corrosion-inhibiting coatings not required
- Manufactured with high-rate plastic film thermoforming processes
- Thin-walled BPPs (<0.2mm) while maintaining low areal specific resistance and low gas permeability
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